Characterization of Endpoint and Wafer Level Non-Uniformity using In-situ Thermography
نویسندگان
چکیده
Abstract This paper investigates in-situ thermographic imaging of a CMP pad during polish to extract spatial endpoint uniformity and polish rate uniformity across the wafer. IR images of the pad contain subtle temperature gradients masked by noise, making endpoint detection difficult. Also effects such as slurry flow, head oscillation, camera angle, and a baseline temperature increase in the pad as heat builds up with each revolution all contribute to the temperatures measured on the pad. Computer based IR image processing may provide a way to filter out these effects to assess the true temperature changes due to the removal of material and thus provide information regarding endpoint and removal rate.
منابع مشابه
Endpoint in plasma etch process using new modified w-multivariate charts and windowed regression
Endpoint detection is very important undertaking on the side of getting a good understanding and figuring out if a plasma etching process is done in the right way, especially if the etched area is very small (0.1%). It truly is a crucial part of supplying repeatable effects in every single wafer. When the film being etched has been completely cleared, the endpoint is reached. To ensure the desi...
متن کاملCharacterization and Modeling of Wafer and Die Level Uniformity in Deep Reactive Ion Etching (DRIE)
Wafer and die level uniformity effects in Deep Reactive Ion Etching (DRIE) are quantitatively modeled and characterized. A two-level etching model has been developed to predict non-uniformities in high-speed rotating microstructures. The separation of wafer level and die level effects is achieved by sequentially etching wafers with uniformly distributed holes. The wafer level loadings range fro...
متن کاملFPGA-based of Thermogram Enhancement Algorithm for Non-destructive Thermal Characterization
متن کامل
Applications of phase sensitive thermography for nondestructive evaluation
The technique of thermal wave thermography combines advantages of both conventional thermal wave measurement and thermography using a commercial IR camera. This technique allows for shorter imaging time and depth profiling. Non-uniformity of heating area and optical surface structures can be suppressed in phase images. Several examples show the potential applications of thermal wave thermograph...
متن کاملPerformance of a novel wafer scale CMOS active pixel sensor for bio-medical imaging.
Recently CMOS active pixels sensors (APSs) have become a valuable alternative to amorphous silicon and selenium flat panel imagers (FPIs) in bio-medical imaging applications. CMOS APSs can now be scaled up to the standard 20 cm diameter wafer size by means of a reticle stitching block process. However, despite wafer scale CMOS APS being monolithic, sources of non-uniformity of response and regi...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
عنوان ژورنال:
دوره شماره
صفحات -
تاریخ انتشار 2000